Here is placeholder text for Heading 1 h1.

On March 25, SEMICON China 2026, the global semiconductor industry’s premier event, kicked off with great fanfare at the Shanghai New International Expo Center. As a leading domestic provider of precision fluid control and vacuum technology solutions, Gaoke Technology showcased a range of core products and advanced packaging equipment at booth T3247, highlighting its innovative capabilities in critical semiconductor components and its comprehensive end-to-end industrial-chain strategy.

PART 01 Core Focus: Deeply cultivating precision fluid control, covering all process requirements.

Gao Kai Technology has consistently focused on the independent research, development, and manufacturing of precision fluid control and vacuum technologies. At this year’s SEMICON, the company unveiled a comprehensive portfolio of products spanning the entire semiconductor process flow, precisely addressing the industry’s diverse needs.

Among these, products such as MFC thermal mass flow controllers, high‑temperature mass flow controllers, pressure‑type mass flow controllers, and dual‑range mass flow controllers—thanks to their high accuracy, exceptional stability, and wide span ratios—can precisely meet the stringent flow‑control requirements of critical processes like etching, deposition, and diffusion, even under challenging conditions involving specialty gases, high‑temperature gases, and complex operating environments.

In response to the diverse applications of process gas distribution, Gao Kai Technology simultaneously showcased the FRC flow‑proportional distributor, a liquid flowmeter–vaporizer combination, as well as the MFV flow calibrator, the UPC back‑helium pressure controller, and the VDM water‑vapor controller.

Among these, the integrated solution combining a liquid flow meter with a vaporizer ensures precise delivery and stable vaporization of liquid precursors and other liquid sources; meanwhile, the back‑helium pressure controller is specifically designed for applications such as wafer cooling and leak detection, further underscoring the company’s deep expertise in core measurement and control technologies.

PART 02 Strengthened by Expertise: Vacuum Control Valves—Building a Robust Core for Equipment Support

In the field of vacuum control, Gao Kai Technology showcased a diverse portfolio of valve products, including TV vacuum butterfly valves, sealed‑type butterfly valves, and an innovative butterfly‑gate valve combination.

As critical actuation units for process chamber pressure control and vacuum‑environment maintenance, these products—characterized by rapid response, high reliability, and long service life—provide robust support for the pneumatic systems of semiconductor equipment.

PART 03: A New Breakthrough—Pioneering Advanced Packaging and Expanding the Solutions Portfolio

At this year’s exhibition, Gao Kai Technology showcased its latest advancements in the field of advanced packaging—namely, prototype coating and scribing equipment, as well as underfill equipment for FC chips.

These two devices focus on the high-precision dispensing, coating, and filling stages of back-end packaging processes, demonstrating the company’s exceptional capability to extend its offerings from core components to advanced packaging equipment solutions, thereby providing critical process support for cutting-edge packaging technologies such as chiplets and 3D packaging.

Jointly Exploring New Paths for the Future of the Semiconductor Industry

With precision fluid control at its core and driven by independent innovation, GaoKai Technology is helping semiconductor equipment achieve greater process accuracy and operational efficiency through an ever‑expanding product portfolio and system‑level solutions.

We cordially invite you to visit Booth T3247 to jointly explore the future of semiconductor core components and advanced packaging technologies.

END