English Translation

On May 16, 2026, the 2026 Yangtze River Delta IC “Advanced Packaging and Test” Technology & Industrial Ecosystem Conference, co-hosted by TruthSemi Alliance and IICIE International Integrated Circuit Innovation Expo, successfully concluded at Pullman New Lake Hotel, Xinwu District, Wuxi.

With the theme of Advanced Packaging in the AI Era, the conference brought together leading enterprises across the full industrial chain, including chip design, wafer fabrication, packaging & test, core equipment, key materials and components, to jointly discuss technological iteration and industrial collaborative development of advanced packaging and testing.

Keynote Speech: Technology Empowerment

As a domestic leader in precision fluid control, Gaokai Technology was invited to attend this grand event.

At the special forum titled Advanced Packaging “Hardcore Innovation” — Technology Empowering AI Computing Power, Gaokai delivered an excellent presentation named Core Processes of Advanced Packaging — Coating and UF Equipment Solutions, fully demonstrating the company’s technical accumulation and innovation achievements in critical dispensing processes for semiconductor packaging.

Overcome Challenges, Build Closed-Loop Full-Chain Capability

Gaokai launches end-to-end closed-loop dispensing solutions

As advanced packaging technologies such as AI chips, HBM (High Bandwidth Memory) and Chiplet are rapidly deployed, the precision and reliability of dispensing processes have become key factors determining product yield and performance. However, the industry generally faces pain points including difficult glue flow control, stringent dispensing accuracy requirements and tough process adaptation.

To address these challenges, Gaokai has proposed a complete closed-loop solution: hardware selection → process control → software algorithm → in-line inspection → production line integration. According to the product manager’s presentation, leveraging self-developed piezoelectric jet valves, high-precision motion platforms, intelligent vision algorithms and full-process control software, Gaokai delivers comprehensive coverage from individual modules to full-line solutions, providing customers with one-stop intelligent customized services.

Exquisite Craftsmanship & Strong Technology for Competitive Edge

Two core process solutions demonstrate robust technical strength

Coating Process Solution

In Coating processes for MEMS, FCBGA and CCM products, long-standing industry challenges include glue contamination, gold wire deformation, unstable glue volume and dispensing offset.

The GK-800M automated dispensing machine launched by Gaokai adopts Class 100 mirror dust-proof design, cyclic loading/unloading and modular quick-switch structure to effectively resolve the above issues. 01 Equipped with Gaokai’s self-developed piezoelectric jet valve for stable glue dispensing without stringing; 02 Natural granite platform paired with linear motors and linear encoders to guarantee high-precision motion; 03 Self-developed software supports automatic glue weight compensation, parameter locking and monitoring. Combined with vision algorithms, it realizes precise positioning and post-operation inspection.

This equipment has achieved mass shipment and is widely applied in advanced packaging scenarios including FCBGA, CCM and MEMS.

UF Underfill Process Solution

GK-600UF

Targeting pain points in UF underfill processes such as uncontrollable glue flow, glue wicking and poor dispensing precision, Gaokai introduced the GK-600UF underfill dispensing system. 01 The machine adopts dual-track cross operation design, supports substrate width ranging from 60 mm to 170 mm, with repeat positioning accuracy of ±0.01 mm. 02 Three-stage precise temperature control platform together with mirror dust-proof design ensures process stability. 03 Fitted with Gaokai’s 4th-generation PZT piezoelectric jet valve, it achieves dispensing control accuracy of ±0.01 mm. Featuring easy maintenance and high precision, it can flexibly adapt to various automated production lines.

Furthermore, Gaokai provides 7×24-hour after-sales response, full-lifecycle management and software & hardware upgrade services to safeguard stable customer production capacity.

Technology as Core, Win-Win Ecosystem

In the era of AI computing power, advanced packaging has become a core segment defining high-performance computing chips. As a critical procedure within packaging manufacturing, dispensing process precision and reliability directly affect chip performance and yield.

This conference not only showcases Gaokai’s leading strength in Coating and UF processes, but also demonstrates the company’s resolve to continuously delve into core semiconductor packaging equipment and empower collaborative innovation across the industrial chain.

Moving forward, adhering to the philosophy of Technology as Core, Win-Win Ecosystem, Gaokai Technology will contribute its strength to drive high-quality development of China’s advanced packaging industry!

About Gaokai Technology

Founded in 2013 and headquartered in Changzhou, Jiangsu Province, Jiangsu Gaokai Precision Fluid Technology Co., Ltd. is a leading domestic provider of precision fluid control solutions.

The company specializes in the research and application of piezoelectric actuation and precision fluid control technologies, engaging in R&D, production and sales of key control components and related equipment within the precision fluid control sector. Currently, its product portfolio centers on mass flow control series, dispensing & packaging series and coating series, and extends to more types of precision fluid control components and equipment such as semiconductor vacuum system parts. Products are widely deployed in intelligent manufacturing sectors including semiconductors, new energy, automotive electronics and consumer electronics.