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Release time:

2017-07-15

Before using a dispensing machine, you must first fully master its operational knowledge and then proceed with equipment operation. Before turning on the machine, be sure to check whether the power supply and voltage are stable. After starting the machine, pay close attention to whether it emits any unusual noises. If you notice any abnormal sounds, immediately turn off the machine, troubleshoot the issue, and then restart it only after resolving the problem. To help everyone better ensure product quality and improve production efficiency, let’s now discuss the five key points of dispensing machine operation. First, based on practical experience, the diameter of the glue dot should be half the pitch between solder pads; after component placement, the diameter of the glue dot should be 1.5 times its original size. This ensures that there is sufficient adhesive to securely bond the components.

Before using a dispensing machine, you must first fully master its operational knowledge and then proceed with the equipment’s operation. Before turning on the machine, be sure to check whether the power supply and voltage are stable. After starting the machine, pay close attention to whether it emits any unusual noises. If you notice any abnormal sounds, immediately turn off the machine, troubleshoot the issue, and then restart it. To help everyone better ensure product quality and improve production efficiency, let’s now discuss the five key points of knowledge for operating a dispensing machine.

1. Based on work experience, the diameter of the adhesive dots should be half the pitch between solder pads. After component placement, the diameter of the adhesive dots should be 1.5 times their original size. This ensures sufficient adhesive to bond the components while preventing excessive adhesive from spreading onto the solder pads.

II. Dispensing Pressure (Backpressure)

Excessive back pressure can easily lead to胶溢出 (胶料溢出) and excessive胶量 (excessive胶料用量); too little pressure, on the other hand, may cause intermittent dispensing and missed dots, resulting in defects. The appropriate pressure should be selected based on the quality of the adhesive and the ambient temperature. When the ambient temperature is high, the viscosity of the adhesive decreases and its flowability improves; in such cases, reducing the back pressure can ensure a steady supply of adhesive. The opposite is true as well.

III. Needle Size

In practical work, the inner diameter of the dispensing needle should be half the diameter of the glue dot being dispensed. During the dispensing process, the dispensing needle should be selected based on the size of the solder pads on the PCB: For example, if the sizes of 0805 and 1206 solder pads are not significantly different, the same type of needle can be used. However, for solder pads with vastly different sizes, different needles must be chosen. This approach ensures both high-quality glue dots and improved production efficiency.

4. Distance between the needle and the PCB board

Different automatic dispensing machines use different needles, and some needles have a certain amount of stop play. At the start of each job, it is necessary to calibrate the distance between the needle and the PCB—that is, to perform Z-axis height calibration.

V. Glue Temperature

Generally, epoxy resin adhesives should be stored in a refrigerator at a temperature between 0 and 5°C. Before use, they should be removed from the refrigerator about 30 minutes in advance to allow the adhesive to fully reach the working temperature. The recommended operating temperature for the adhesive is between 23°C and 25°C. Ambient temperature significantly affects the viscosity of the adhesive: if the temperature is too low, the adhesive droplets will become smaller and may exhibit stringing. A 5°C difference in ambient temperature can result in a 50% change in the amount of adhesive dispensed. Therefore, it is crucial to maintain strict control over the ambient temperature. At the same time, the ambient humidity must also be carefully regulated—low humidity can cause the adhesive droplets to dry out quickly, thereby compromising the bonding strength.

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