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What are the specific features of laser soldering systems?
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Release time:
2021-11-03
Speaking of laser soldering systems, friends in the laser welding field are probably already familiar with this new laser welding technology that employs laser-induced jetting of solder balls for bonding. Currently, this technology is widely used in various applications, such as soldering assembly of data cable connectors, soldering connection points on flexible printed circuits for mobile phones and digital cameras, soldering high-definition camera modules, sensor soldering, soldering of high-precision electronic components for aerospace and aviation, soldering of precision acoustic devices, and soldering of high-precision components like HDDs (HGA, HSA), MEMS, and BGAs.
Speaking of laser soldering systems, friends in the laser welding field are probably already familiar with this new welding technology that employs laser-induced jetting of solder balls for bonding. Currently, it’s widely used in various applications, such as soldering assembly of data cable connectors, soldering connection points on flexible printed circuits for mobile phones and digital cameras, soldering high-definition camera modules, sensor soldering, soldering of high-precision electronic components for aerospace and aviation, soldering of precision acoustic devices, and soldering of high-precision components like HDDs (HGA, HSA), MEMS, and BGAs.
Its wide range of applications is closely linked to its inherent characteristics and advantages. So, what exactly are the product’s specific features? Next, let’s all take a closer look together:
1. The laser soldering system features non-contact operation, the absence of flux, minimal heat input, and precise control over solder material. It uses a combination of laser irradiation and inert gas to spray molten solder droplets at a specific temperature onto metallized pads. The heat carried by these solder droplets enables precise deposition onto the surface of the area to be welded, heating the pads to form bumps or achieve bonding.
2. Compared with conventional soldering methods, this technique features impact-induced deformation and instantaneous solidification, highlighting its unique process characteristics. Using a laser-assisted soldering system for this type of welding allows for the realization of extremely small-scale interconnections to a certain extent—solder droplet sizes can be as small as tens of micrometers—and the distribution of solder balls occurs simultaneously with the heating process, resulting in exceptionally high production efficiency.
3. The laser soldering system for solder ball application boasts an exceptionally fast welding speed, making it particularly well-suited for soldering small via-type pads and three-dimensional spatial pads. By digitally controlling the solder balls, the system achieves precise positioning of the solder jet, enabling interconnections with extremely narrow pitch. Moreover, the connection process does not require any physical contact between tools and components, thus preventing damage to component surfaces that could result from such contact.
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